Our IC packaging mold parts are widely applied in industries such as semiconductor manufacturing, consumer electronics (smartphones, laptops), automotive electronics (ADAS systems), and industrial controls (IoT devices).
Our IC packaging mold parts stand out with full-lifecycle service capabilities, covering high-precision machining, and technical after-sales support. We specialize in customized solutions tailored to your unique demands—whether it’s micro-cavity structures, ultra-tight tolerances (up to ±0.002mm), or specialized surface treatments.
Stringent quality control is implemented throughout the production process, featuring advanced testing equipment and compliance with ISO 9001 standards to guarantee consistent performance.
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